The Moisture Sensitivity Level; Baking Requirements - SIM Tech SIMCom SIM800C Hardware Design

7.3. The Moisture Sensitivity Level

The moisture sensitivity level of SIM800C module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30℃ and relative humidity of <60% (RH). It is
necessary to bake the module if the above conditions are not met:
Table 41: Moisture sensitivity level and floor life
Moisture Sensitivity Level
(MSL)
1
2
2a
3
4
5
5a
6
NOTES:
For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.

7.4. Baking Requirements

SIM800C modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under
the following conditions: the environment temperature is lower than 40℃, and the air humidity is less than 90%.
If the condition meets one of the following ones shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in below table; otherwise the module will be at the risk of
permanent damage during re-flow soldering.

If the vacuum package is broken or leakage

If the vacuum package is opened after 6 months since it's been packed

If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient≦30℃
/60%RH or as stated
.
Table 42: Baking requirements
Baking temperature
40℃±5℃
120℃±5℃
Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for
preheating, otherwise the tray may be damaged by high-temperature heating.
SIM800C_Hardware_Design_V1.00
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated
Unlimited at ≦30℃/85% RH
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
Mandatory bake before use. After bake, it must be reflowed within the time limit
specified on the label.
;
Moisture
<5%
<5%
49
Smart Machine Smart Decision
;
Time
192 hours
6 hours
2014-10-30