Packaging; Tape And Reel Packaging - Quectel BC66 Hardware Design

Reflow Zone
Max slope
Reflow time (D: over 220° C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTES
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module's shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours' Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly
identifiable and the QR code is still readable, although white rust may be found.

7.3. Packaging

The modules are stored in a vacuum-sealed bag which is ESD protected. The bag should not be opened
until the devices are ready to be soldered onto the application.

7.3.1. Tape and Reel Packaging

The reel is 330mm in diameter and each reel contains 250 modules.
BC66_Hardware_Design
NB-IoT Module Series
BC66 Hardware Design
2 to 3° C/sec
40 to 60 sec
240° C ~ 245° C
1 to 4° C/sec
1
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