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Quectel M10 Hardware Design

Cellular engine
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M10
Quectel Cellular Engine
Hardware Design
M10_HD_V3.0

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  • Page 1 Quectel Cellular Engine Hardware Design M10_HD_V3.0...
  • Page 2 Document Control ID General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel. Quectel has not undertaken any independent search for additional information, relevant to any information that may be in the customer’s possession.

  • Page 3: Table Of Contents

    M10 Hardware Design Contents Contents ............................2 Table Index ............................4 Figure Index ............................5 0. Revision history ..........................7 1. Introduction ........................... 9 1.1. Related documents ......................9 1.2. Terms and abbreviations ....................10 1.3. Directives and standards ....................12 1.3.1.
  • Page 4 M10 Hardware Design 3.9.1. Decrease TDD noise and other noise ..............47 3.9.2. Microphone interfaces configuration ............... 48 3.9.3. Receiver and speaker interface configuration ............49 3.9.4. Earphone interface configuration ................51 3.10. SIM card interface ......................52 3.10.1. SIM card application ..................... 52 3.10.2.
  • Page 5 M10 Hardware Design Table Index TABLE 1: RELATED DOCUMENTS ..................... 9  TABLE 2: TERMS AND ABBREVIATIONS ................10  TABLE 3: MODULE KEY FEATURES ..................15  TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ........................17  TABLE 5: PIN DESCRIPTION ...................... 20 ...
  • Page 6 M10 Hardware Design Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ..............18  FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT ............19  FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ....26  FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ....27 ...
  • Page 7 FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE ............65  FIGURE 47: RECOMMENDATION OF RF PAD WELDING ............. 67  FIGURE 48: M10 TOP AND SIDE DIMENSIONS（UNIT: MM） ..........73  FIGURE 49: M10 BOTTOM DIMENSIONS（UNIT: MM） ............74  FIGURE 50: PAD BOTTOM DIMENSIONS（UNIT: MM） ............74 ...

  • Page 8: Revision History

    M10 Hardware Design 0. Revision history Revision Date Author Description of change 1.00 2009-06-27 Tracy ZHANG Initial 1.01 2009-09-18 Yong AN 1. Modified VRTC voltage inputting range. 2. Modified Figure 1. 3. Added Table 7 and Figure 4 with remark.
  • Page 9 M10 Hardware Design 7. Deleted the content of charging function. M10_HD_V3.0 - 8 -...

  • Page 10: Introduction

    M10 Hardware Design 1. Introduction This document defines the M10 module and describes the hardware interface of M10 module which are connected with the customer application and the air interface. This document can help customer quickly understand module interface specifications, electrical and mechanical details.

  • Page 11: Terms And Abbreviations

    M10 Hardware Design 1.2. Terms and abbreviations Table 2: Terms and abbreviations Abbreviation Description Analog-to-Digital Converter Adaptive Multi-Rate Antenna Reference Point ASIC Application Specific Integrated Circuit Bit Error Rate Bill Of Material Base Transceiver Station CHAP Challenge Handshake Authentication Protocol...
  • Page 12 M10 Hardware Design Abbreviation Description Li-Ion Lithium-Ion Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Radio Frequency Root Mean Square (value) Real Time Clock...

  • Page 13: Directives And Standards

    20cm from the radio antenna of M10 module depending on portable or Mobile status. Note: If a portable device (such as PDA) uses M10 module, the device needs to do permissive change and SAR testing.

  • Page 14: Safety Cautions

    Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions.
  • Page 15 M10 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call.

  • Page 16: Product Concept

    M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS, Security, Telematics, Remote Controlling, etc. M10 is an SMD type module, which can be embedded in customer application through its 64-pin pads. It provides all hardware interfaces between the module and customer’s host board.
  • Page 17 M10 Hardware Design  Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C  Storage temperature: -45°C ~ +90°C  DATA GPRS: GPRS data downlink transfer: max. 85.6 kbps  GPRS data uplink transfer: max. 85.6 kbps  Coding scheme: CS-1, CS-2, CS-3 and CS-4 ...

  • Page 18: Functional Diagram

    CS-3: 15.6kbps 31.2kbps 62.4kbps CS-4: 21.4kbps 42.8kbps 85.6kbps 2.2. Functional diagram The following figure shows a block diagram of M10 and illustrates the major functional parts.  Power management  Baseband  Serial Flash  The GSM radio frequency part ...

  • Page 19: Evaluation Board

    Figure 1: Module functional diagram   2.3. Evaluation board In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB) that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the module.

  • Page 20: Application Interface

    Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6. 3.1. Pin of module 3.1.1. Pin assignment The following figure shows pin name and assignment of M10. Figure 2: Top view of module pin assignment M10_HD_V3.0 - 19 -...

  • Page 21: Pin Description

    M10 Hardware Design 3.1.2. Pin description Table 5: Pin description Power supply PIN NAME DESCRIPTION COMMENT CHARACTERISTICS VBAT 50,51 Module main Vmax= 4.6V It must be able to power supply. Vmin=3.3V provide sufficient VBAT=3.3V~4.6V Vnorm=4.0V current in a transmitting burst which typically rises to 1.6A.
  • Page 22 M10 Hardware Design EMERG_ Emergency off. VILmax=0.4V Open Pulling down for VIHmin=2.2V drain/collector at least 20ms will max=2.8V driver required in open turn off the module cellular device in case of application. emergency. Use it If unused, keep only when normal this pin open.
  • Page 23 M10 Hardware Design KBC0~ 33~37 Keypad interface VILmin=-0.3V If unused, keep KBC4 VILmax= these pins open. 0.25*VDD_EXT KBR0~ 28~32 Pull up to VIHmin= KBR4 VDD_EXT, if 0.75*VDD_EXT unused, keep these VIHmax= pins open. VDD_EXT+0.3 GPIO1_ Normal If unused, keep VOLmax=...
  • Page 24 M10 Hardware Design SD_CLK SD serial clock VILmax= these pins open. 0.25*VDD_EXT If used, SD_CMD SD command VIHmin= SD_DATA is 0.75*VDD_EXT connected to SD VIHmax= card DATA0 pin. VDD_EXT+0.3 VOLmax= 0.15*VDD_EXT VOHmin= 0.85*VDD_EXT SIM interface PIN NAME DESCRIPTION COMMENT CHARACTERISTICS...
  • Page 25 M10 Hardware Design 0.9*SIM_VDD VOLmax= 0.12*SIM_VDD VOHmin= 0.9*SIM_VDD SIM_RST SIM reset When SIM_VDD=3V VILmax=0.36V VIHmin= 0.9*SIM_VDD VOLmax=0.4V VOHmin= 0.9*SIM_VDD When SIM_VDD=1.8V VILmax= 0.12*SIM_VDD VIHmin= 0.9*SIM_VDD VOLmax= 0.12*SIM_VDD VOHmin= 0.9*SIM_VDD SIM_ SIM card detection VILmax=0.67V If unused, keep PRESENCE VIHmin=1.7V this pin open.

  • Page 26: Operating Modes

    M10 Hardware Design 3.2. Operating modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Mode Function Normal GSM/GPRS The module will automatically go into SLEEP mode if DTR...

  • Page 27: Power Supply

    M10 Hardware Design Alarm mode RTC alert function launches this restricted operation while the module is in POWER DOWN mode. The module will not be registered to GSM network and only parts of AT commands can be available. 1) Use the EMERG_OFF pin only while failing to turn off the module by the command “AT+QPOWD=1”...

  • Page 28: Power Supply Pins

    M10 Hardware Design 4.615ms 577us Burst:1.6A IBAT Max:400mV VBAT Figure 4: Ripple in supply voltage during transmitting burst  3.3.1. Power supply pins The VBAT pins are dedicated to connect the module supply voltage. VRTC pin can be used to connect a rechargeable coin battery or a golden capacitor which can help to maintain the system clock when VBAT supply is not applied.

  • Page 29: Monitor Power Supply

    M10 Hardware Design C1>=100uF; C2=0.1uF~1uF; C3=10pF; C4=33pF Figure 5: Reference circuit of the VBAT input  3.3.3. Monitor power supply To monitor the supply voltage, you can use the “AT+CBC” command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0-100 percent of battery capacity and actual value measured between VBAT and GND.

  • Page 30: Figure 6: Turn On The Module Using Driving Circuit

    M10 Hardware Design module and save the configuration to flash memory of module. After these configurations, the URC “RDY” would be received from the Serial Port of module every time when the module is powered on. Refer to Chapter “AT+IPR” in document [1].
  • Page 31 M10 Hardware Design The power on scenarios is illustrated as following figure. 54ms VBAT EMERG_OFF (INPUT) >1s > 0.6*VBAT PWRKEY <0.1*VBAT (INPUT) VDD_EXT (OUTPUT) 800ms STATUS (OUTPUT) MODULE BOOTING RUNNING STATUS Figure 8: Timing of turning on system ① Make sure that VBAT voltage is stable before pulling down PWRKEY pin. The interval time between them is recommended 30ms.

  • Page 32: Power Down

    M10 Hardware Design the module will go into the alarm mode. In this case, the module will send out an Unsolicited Result Code (URC) when the baud rate of the Serial Port is set to a fixed one. ALARM MODE...
  • Page 33 M10 Hardware Design 3.4.2.1. Power down module using the PWRKEY pin Customer’s application can turn off the module by driving the PWRKEY to a low level voltage for certain time. The power-down scenario is illustrated as in Figure 9. The power-down procedure causes the module to log off from the network and allows the software to save important data before completely disconnecting the power supply, thus it is a safe way.
  • Page 34 M10 Hardware Design data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure, the module sends out the result code as shown below: NORMAL POWER DOWN After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active.

  • Page 35: Figure 10: Reference Circuit For Emerg_Off By Using Driving Circuit

    M10 Hardware Design 3.4.2.4. Emergency shutdown The module can be shut down by driving the pin EMERG_OFF to a low level voltage for over 20ms and then releasing it. The EMERG_OFF line can be driven by an Open Drain/Collector driver or a button.

  • Page 36: Restart Module Using The Pwrkey Pin

    M10 Hardware Design 3.4.3. Restart module using the PWRKEY pin Customer’s application can restart the module by driving the PWRKEY to a low level voltage for certain time, which is similar to the way to turn on the module. Before restarting the module, at least 500ms should be delayed after detecting the low level of STATUS.

  • Page 37: Power Saving

    M10 Hardware Design 3.5. Power saving Upon system requirement, there are several actions to drive the module to enter low current consumption status. For example, “AT+CFUN” can be used to set the module into minimum functionality mode and DTR hardware interface signal can be used to lead system to SLEEP mode.

  • Page 38: Wake Up Module From Sleep Mode

    M10 Hardware Design 3.5.3. Wake up module from SLEEP mode When the module is in the SLEEP mode, the following methods can wake up the module. If the DTR Pin is pulled down to a low level, it would wake up the module from the SLEEP mode.

  • Page 39: Figure 14: Rtc Supply From Non-Chargeable Battery

    M10 Hardware Design Figure 14: RTC supply from non-chargeable battery Figure 15: RTC supply from rechargeable battery MODULE 1.5K VRTC Core Large Capacitance Capacitor Figure 16: RTC supply from capacitor Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used.

  • Page 40: Serial Interfaces

    M10 Hardware Design Figure 17: Seiko XH414H-IV01E Charge Characteristic 3.8. Serial interfaces The module provides two unbalanced asynchronous serial ports including Serial Port, Debug Port. The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps.

  • Page 41: Uart Port

    M10 Hardware Design The Debug Port:  DBG_TXD: Send data to the COM port of a debugging computer  DBG_RXD: Receive data from the COM port of a debugging computer UART3:  TXD_AUX: Send data to the RXD of DTE ...
  • Page 42 M10 Hardware Design The module disables hardware flow control in default, AT command “AT+IFC=2,2” is used  to enable hardware flow control. Used for AT command, GPRS data, CSD FAX, etc. Multiplexing function is supported on the  UART Port. So far only the basic mode of multiplexing is available.

  • Page 43: Figure 18: Connection Of All Functional Uart Port

    M10 Hardware Design 3.8.1.2. The connection of UART The connection between module and host via UART port is very flexible. Three connection styles are illustrated as below. UART Port connection is shown as below when it is applied in modulation-demodulation.

  • Page 44: Debug Port

    M10 Hardware Design reliability of the mass data communication. Figure 20: Connection of UART port with hardware flow control 3.8.1.3. Software upgrade The TXD and RXD can be used to upgrade software. The PWRKEY pin must be pulled down before the software upgrade. Please refer to the following figure for software upgrade.

  • Page 45: Uart Port 3

    M10 Hardware Design 460800bps. Figure 22: Connection of software debug  3.8.3. UART Port 3 UART3:  Two data lines: TXD3and RXD3  UART3 port is used for AT command only and does not support GPRS data, CSD FAX, Multiplexing function etc.

  • Page 46: Uart Application

    M10 Hardware Design 3.8.4. UART Application The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is 3V, the divider resistor should be changed from 5.6K to 10K. Figure 24: 3.3V level match circuit The reference design of 5V level match is shown as below.

  • Page 47: Audio Interfaces

    M10 Hardware Design The following picture is an example of connection between module and PC. A RS_232 level shifter IC or circuit must be inserted between module and PC, since these three UART ports do not support the RS_232 level, while support the CMOS level only.

  • Page 48: Decrease Tdd Noise And Other Noise

    M10 Hardware Design Table 11: Pin definition of Audio interface Interface Name Function MIC1P Microphone1 input + MIC1N Microphone1 input - (AIN1/AOUT1) SPK1P Audio1 output+ SPK1N Audio1 output- MIC2P Microphone2 input + MIC2N Microphone2 input - SPK2P Audio2 output+ (AIN2/AOUT2) AGND Suggested to be used in audio circuit.

  • Page 49: Microphone Interfaces Configuration

    M10 Hardware Design The severity degree of the RF interference in the voice channel during GSM transmitting period largely depends on the application design. In some cases, GSM850/GSM900 TDD noise is more severe; while in other cases, DCS1800/PCS1900 TDD noise is more obvious. Therefore, customer can have a choice based on test results.

  • Page 50: Receiver And Speaker Interface Configuration

    M10 Hardware Design 3.9.3. Receiver and speaker interface configuration Close to speaker Differential layout 10pF 33pF Module SPK1P 10pF 33pF SPK1N 10pF 33pF Figure 28: Speaker interface configuration of AOUT1 Close to speaker Differential layout Amplifier 33pF 10pF circuit Module...

  • Page 51: Figure 30: Speaker Interface Configuration Of Aout2

    M10 Hardware Design Close to speaker Differential layout 10pF 33pF 22uF Module SPK2P AGND Figure 30: Speaker interface configuration of AOUT2 Close to speaker Differential layout Amplifier 10pF 33pF circuit SPK2P Module AGND 10pF 33pF Figure 31: Speaker interface with amplifier configuration of AOUT2 Note: The value of C1 and C2 depends on the input impedance of audio amplifier .

  • Page 52: Earphone Interface Configuration

    M10 Hardware Design 3.9.4. Earphone interface configuration Close to Socket Differential layout 4.7uF 33pF 33pF MIC2N MIC2P Module 22uF SPK2P AGND 33pF 10pF Amphenol 9001-8905-050 AGND AGND Figure 32: Earphone interface configuration Table 12: Typical electret microphone characteristic Parameter Type...

  • Page 53: Sim Card Interface

    M10 Hardware Design 3.10. SIM card interface 3.10.1. SIM card application The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM card, which is intended for use with a SIM application Tool-kit.

  • Page 54: Figure 33: Reference Circuit Of The 8 Pins Sim Card

    M10 Hardware Design VDD_EXT 100nF SIM_CARD SIM_VDD SIM_RST Module SIM_CLK SIM_PRESENCE PRESENCE SIM_DATA ESDA6V8V6 Figure 33: Reference circuit of the 8 pins SIM card Note: Please do not use “AT+QSIMDET=1,1” which causes to initialize SIM card when Figure 33 circuit is adopted.

  • Page 55: Design Considerations For Sim Card Holder

    M10 Hardware Design In SIM interface designing, in order to ensure good communication performance with SIM card, the following design principles should be complied with.  Place the SIM card holder close to module as close as possible. Ensure the trace length of SIM signals do not exceed 20mm.

  • Page 56: Table 15: Pin Description Of Amphenol Sim Card Holder

    M10 Hardware Design Table 15: Pin description of Amphenol SIM card holder Name Function SIM_VDD SIM Card Power supply SIM_RST SIM Card Reset SIM_CLK SIM Card Clock Ground Not Connect SIM_DATA SIM Card data I/O For 8-pin SIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for more information.

  • Page 57: Keypad Interface

    M10 Hardware Design Not Connect SIM_DATA SIM Card Data I/O SIM_DETECT Pulled down GND with external circuit. When the tray is present, C4 is connected to C8. 3.11. Keypad interface The keypad interface consists of 5 keypad column inputs and 5 keypad row outputs. The basic configuration is 5 keypad columns and 5 keypad rows, giving 25 keys.

  • Page 58: Adc

    M10 Hardware Design Module KBC0 KBC1 KBC2 KBC3 KBC4 GPIO1_KBC5 KBR0 KBR1 KBR2 KBR3 KBR4 Figure 37 : Reference circuit of the keypad interface If a 5*5 matrix does not provide enough keys, GPIO1 could be multiplexed as KBC5 to configure a 5*6 keypad matrix.

  • Page 59: Behaviors Of The Ri

    M10 Hardware Design Table 19: Characteristic of the ADC Item Units Voltage range ADC Resolution bits ADC accuracy 3.13. Behaviors of the RI Table 20: Behaviors of the RI State RI response Standby HIGH Voice calling Changed to LOW, then: 1.

  • Page 60: Figure 38: Ri Behaviour Of Voice Calling As A Receiver

    M10 Hardware Design Figure 38: RI behaviour of voice calling as a receiver Figure 39: RI behaviour of data calling as a receiver Figure 40: RI behaviour as a caller M10_HD_V3.0 - 59 -...

  • Page 61: Network Status Indication

    M10 Hardware Design Figure 41: RI behaviour of URC or SMS received 3.14. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in Table 21.

  • Page 62: Operating Status Indication

    M10 Hardware Design 3.15. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on, please refer to Chapter 3.4 . In customer design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the module’s operation status.

  • Page 63: Open Drain Output (Light_Mos)

    Name Function LIGHT_MOS Open drain output port Note: This function is not supported in the default firmware. There must be special firmware if customer needs this function. Please contact Quectel for more details. VBAT Module 300R LIGHT_MOS Figure 44: Reference circuit of the LIGHT_MOS M10_HD_V3.0...

  • Page 64: Sd Card Interface

    M10 Hardware Design 3.18. SD card interface The module provides SD card interface that supports many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD card interface.

  • Page 65: Table 26: Pin Name Of The Sd Card And T-Flash(Micro Sd) Card

    M10 Hardware Design Table 26: Pin name of the SD card and T-Flash(Micro SD) card Pin NO. Pin name of SD card Pin name of T-Flash(Micro SD) card CD/DATA3 DATA2 CD/DATA3 VSS1 VSS2 DATA0 DATA0 DATA1 DATA1 DATA2 In SD card interface designing, in order to ensure good communication performance with SD card, it should be complied with following design principles.

  • Page 66: Antenna Interface

    Figure 46: Reference circuit of RF interface 4.1. Antenna installation M10 provides an RF antenna PAD for customer’s antenna connection. The RF trace in host PCB connecting to the module RF antenna pad should be micro-strip line or other types of RF trace, whose characteristic resistance should be close to 50Ω.

  • Page 67: Rf Output Power

    M10 Hardware Design 4.2. RF output power Table 28: The module conducted RF output power Frequency GSM850 33dBm ±2dB 5dBm±5dB EGSM900 33dBm ±2dB 5dBm±5dB DCS1800 30dBm ±2dB 0dBm±5dB PCS1900 30dBm ±2dB 0dBm±5dB Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in chapter 13.16 of 3GPP TS 51.010-1.

  • Page 68: Figure 47: Recommendation Of Rf Pad Welding

    M10 Hardware Design Figure 47: Recommendation of RF pad welding M10_HD_V3.0 - 67 -...

  • Page 69: Electrical, Reliability And Radio Characteristics

    M10 Hardware Design 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 31: Absolute maximum ratings Parameter...

  • Page 70: Power Supply Ratings

    M10 Hardware Design 5.3. Power supply ratings Table 33: The module power supply ratings Parameter Description Conditions Min Type Unit VBAT Supply Voltage must stay within the voltage min/max values, including voltage drop, ripple, and spikes. Voltage drop Maximum power control level during on GSM850 and GSM900.

  • Page 71: Current Consumption

    M10 Hardware Design Parameter Description Conditions Min Type Unit DCS1800/PCS1900 423/445 Peak supply Maximum power control level current on GSM900. (during transmission slot) Power control level PCL 5 Power control level PCL 0 5.4. Current consumption The values of current consumption are shown in Table 34.
  • Page 72 M10 Hardware Design @power level #15,Typical 66mA DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 12 GSM850 @power level #5 <550mA,Typical 341mA @power level #12,Typical 135mA @power level #19,Typical 85mA EGSM 900 @power level #5 <550mA,Typical 347mA @power level #12,Typical 156mA...

  • Page 73: Electro-Static Discharge

    M10 Hardware Design @power level #19,Typical 109mA EGSM 900 @power level #5 <660mA,Typical 464mA @power level #12,Typical 221mA @power level #19,Typical 117mA DCS 1800 @power level #0 <530mA,Typical 423mA @power level #7,Typical 166mA @power level #15,Typical 99mA PCS 1900 @power level #0 <530mA,Typical 445mA...

  • Page 74: Mechanical Dimensions

    This s chapter desc cribes the me chanical dim mensions of th e module. 6.1. . Mechanic al dimensio ons of mod dule Figure 4 48: M10 top a and side dim mensions（Un nit: mm） M10_ _HD_V3.0 - 73 -...

  • Page 75: Figure 49: M10 Bottom Dimensions（Unit: Mm

    M10 Hardware Design test point Figure 49: M10 bottom dimensions（Unit: mm） Figure 50: PAD bottom dimensions（Unit: mm） M10_HD_V3.0 - 74 -...

  • Page 76: Footprint Of Recommendation

    M10 Hardware Design 6.2. Footprint of recommendation single pad M10_HD_V3.0 - 75 -...

  • Page 77: Figure 51: Footprint Of Recommendation（Unit: Mm

    M10 Hardware Design safe area line module dimension keepout area Figure 51: Footprint of recommendation（Unit: mm） ： Note1 Keep out the area below the test point in the host PCB. Place solder mask. ： Note2 In order to maintain the module, keep about 3mm between the module and other components in host PCB.

  • Page 78: Top View Of The Module

    Hardware De esign 6.3. . Top view of the mod dule Figure 52: Top view of f the module 6.4. . Bottom vi ew of the m module Figure 53: B Bottom view o of the modul le M10_ _HD_V3.0 - 77 -...

  • Page 79: Appendix A: Gprs Coding Schemes

    M10 Hardware Design Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 36. Table 36: Description of different coding schemes Scheme Code USF Pre-coded Radio Tail Coded Punctured...

  • Page 80: Appendix B: Gprs Multi-Slot Classes

    The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes of the M10 module support is shown in Table 37. Table 37: GPRS multi-slot classes...
  • Page 81 Shanghai Quectel Wireless Solutions Co., Ltd. Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China 200233 Tel: +86 21 5108 6236 Mail: info@quectel.com...

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