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Chip Insertion
DIP Encapsulation: The chip is inserted with the notch upwards while its bottom
line is aligned with the bottom line of the DIP socket. The diagram below shows
the process of inserting a 28-pin chip.
None-DIP Encapsulation: Socket adapters are available for PLCC, QFP, SOIC etc.
Insert the chip according to the instructions in the Adapter Information box. The
insertion follows the position of pin 1. It is necessary to identify the pin 1 of the
chip. Usually there is a solid square or dot on the chip which indicates the first pin
of the chip.
Direct-connect: Connect adapters with 144 pins to programmers directely.
Indirect-connect: Insert adapters with 48 pins into DIP on the programmer..
Note:
1. Generally, the pins of the chip are downward when they are inserted. However, for
the chip with PLCC20 package, its pins should be upward. This insertion is called the
"Dead Bug" method.
2.
SUPERPRO/6100 supports 144 pins while SUPERPRO/611S and SUPERPRO/610P only
support 48 pins.
4.1.3.3 Device Configuration Word
35
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