HTC Athena Service Manual page 92

Doc. Title
10. B L
OARD EVEL
Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
Warning：DO NOT overheat the tape and components to avoid the tape melted and make the
component damage.
Step 2 Use Heater Gun (HAKO850B, set the temperature between
℃
350 , Air
Step 3 It has to wait the temperature cool down before the damaged components been removed. Or, the others
components could be gone when the solder-proof tape been taken off.
Step 4 After the damaged components has been replaced; clear the surroundings for solder and flux residues.
51H00331-00M
Location P/N
SW1 36H00160‐00M Slide_Switch,HSS112,HCH
SW3 36H00508‐00M Switch,TSW‐20,SHINMEI
CON5 75H00454‐00M Connector I/O,Normal,11P,0.4Pitch,302‐11101‐00,ACT
CON6 75H00571‐00M
CON8 75H00484‐00M
ACON1
75H00124‐00M Connector Device,BM02B‐ASRS‐TF_LF_SN,2pin,Pitch=1mm,JST
ACON2
ACON3 36H00446‐00M Audio Jack,JP011‐D4BA‐3602XT,3.5mm,T‐MEC
PCG101 16H00012‐00M
PCON101 75H00489‐00M Connector Others,6P,2.5Pitch,3A,6V,30mohm,BTR1Q‐6K2000,ACON
PF101 36H00300‐00M Fuse,046702.5,2.5A/32V,LITTLEFUSE,Apache
HTC CONFIDENTIAL
宏達國際電子股份有限公司
High Tech Computer, Corp.
.
Athena Service Manual
2.5 R
EPAIRS
Speed 3~5) to remove the components.
PCBA-MAIN BOARD(Side A)
Connector
I/O,16P,0.45Pitch,0.5A,5V,30mohm,020030FB016G501ZL,SUYIN
Connector B to
B,80P,0.5Pitch,0.05A,60V,90mohm,AXK5F80537YG,MATSUSHITA
Gold Cap,0.07F,70ohm,3.3V,‐25/+50%,XH414H
II02E,SEIKO,7.6*4.8*1.72mm,,70/‐25degC
Doc. No.
Issued Date
Revised Date
Page
Description
REV.
DOC-00026040
2007/2/15
A02
92 of 102
Substitute
36H00218‐11M