4.15.
PWM....................................................................................................................................................... 45
4.16.
Network Status Indication ...................................................................................................................... 46
4.17.
Operating Status Indication .................................................................................................................... 47
4.18.
KPLED ................................................................................................................................................... 47
4.19.
RF Synchronization Signal ..................................................................................................................... 48
4.20.
Antenna Interface ................................................................................................................................... 48
4.20.1.
GSM Antenna Interface ................................................................................................................... 49
4.20.2.
Bluetooth Antenna Interface ............................................................................................................ 50
5.
PCB Layout .................................................................................................................................................. 51
5.1
PIN Assignment ...................................................................................................................................... 51
5.2
Principle of PCB Layout ......................................................................................................................... 51
5.2.1
Antenna ............................................................................................................................................... 51
5.2.2.
Power Supply ...................................................................................................................................... 51
5.2.3
SIM Card Interface .............................................................................................................................. 51
5.2.4
Audio Interface .................................................................................................................................... 52
5.2.5
Others .................................................................................................................................................. 52
5.3
Recommended PCB Layout ................................................................................................................... 52
6.
6.1
Absolute Maximum Ratings ................................................................................................................... 53
6.2
6.3
6.4
6.5
SIM_VDD Characteristics ...................................................................................................................... 54
6.6
VDD_EXT Characteristics ..................................................................................................................... 54
6.7
VRTC Characteristics ............................................................................................................................. 54
6.8
6.9
Electro-Static Discharge ......................................................................................................................... 56
6.10
Radio Characteristics .............................................................................................................................. 56
6.11
6.12
Module Operating Frequencies............................................................................................................... 57
7.
Manufacturing ............................................................................................................................................. 59
7.1.
7.2.
Typical Solder Reflow Profile ................................................................................................................ 59
7.3.
7.4.
Baking Requirements ............................................................................................................................. 60
8.
Packaging ..................................................................................................................................................... 61
9.
Appendix ...................................................................................................................................................... 63
I.
Related Documents ................................................................................................................................. 63
II.
Terms and Abbreviations ........................................................................................................................ 64
III.
Safety Caution ........................................................................................................................................ 66
SIM800_Hardware Design_V1.10
4
Smart Machine Smart Decision
2018-08-13
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