Wrapping A Heat Shrinkable Sleeve Around The Head Piece/Connection Element - dehn HVI Series Installation Instructions Manual

4.2 Wrapping a heat shrinkable sleeve around the head piece/connection
element
Applying heat shrinkable sleeves
After mounting the head piece/connection element on the HVI
sleeve must be wrapped around the relevant mounting areas to protect them from mechanical, en-
vironmental or chemical influences. The connection set includes two heat shrinkable sleeves.
The following must be observed when wrapping a heat shrinkable sleeve around the head
piece/connection element:
The indicated shrinking area from the head piece/connection element to the HVI
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must be observed (Fig. 2).
The heat shrinkable sleeve is applied from the front shrinking area of the relevant head piece/
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connection element to the HVI
shrinking area. If, required they must be repositioned during the shrinking on process.
The specified shrinking temperature of max. 150 °C must be observed!
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The shrinking temperatures in the shrinking area of the HVI
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In case of excessive shrinking temperatures, the semiconductive sheath of the HVI
can be damaged or destroyed and the function of the HVI
any more.
The heat shrinkable sleeve must not trap air or form bubbles!
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Correct shrinking
Incorrect shrinking
Figure 2 Wrapping a heat shrinkable sleeve around the head piece/connection element
8
long Conductor. The heat shrinkable sleeves must flush with the
®
long Conductor, a heat shrinkable
®
long Conductor must not be too high.
®
long Conductor may not be ensured
®
long Conductor
®
long Conductor
®