Connection Interface; Esd; Figure 2. Airprime Hl7519 Mechanical Overview; Table 3. Esd Specifications - Sierra Wireless AirPrime HL7519 User Manual

User Guide
1.6.

Connection Interface

The AirPrime HL7519 module is an LGA form factor device. All electrical and mechanical connections
are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.
Figure 2. AirPrime HL7519 Mechanical Overview
The 146 pads have the following distribution:

66 inner signal pads, 1x0.5mm, pitch 0.8mm

1 reserved test point (do not connect), 1.0mm diameter

7 test point (JTAG), 0.8mm diameter, 1.20mm pitch

64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm

4 inner corner ground pads, 1x1mm

4 outer corner ground pads, 1x0.9mm
1.7.

ESD

Refer to the following table for ESD Specifications.
Note: Information specified in the following table is preliminary and subject to change.
Table 3. ESD Specifications
Category Connection
Operational RF ports
Host connector
Non-operational
interface
SIM connector
Signals
Other host signals
TBC
Specification
IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)
Unless otherwise specified:

JESD22-A114 +/- 2kV Human Body Model

JESD22-A115 +/- 200V Machine Model

JESD22-C101C +/- 250V Charged Device Model
Adding ESD protection is highly recommended at the point where
the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.
Rev 1.0
Introduction
July 28, 2015 12