Package Description - Linear Technology Analog Devices LT8301 Datasheet

LT8301

PACKAGE DESCRIPTION

3.85 MAX 2.62 REF
RECOMMENDED SOLDER PAD LAYOUT
0.20 BSC
DATUM 'A'
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
22
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635 Rev B)
0.62 0.95
MAX REF
1.22 REF
1.4 MIN
PER IPC CALCULATOR
0.30 – 0.50 REF
0.09 – 0.20
(NOTE 3)
For more information
S5 Package
1.50 – 1.75
2.80 BSC
(NOTE 4)
PIN ONE
0.95 BSC
0.80 – 0.90
1.00 MAX
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2.90 BSC
(NOTE 4)
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
1.90 BSC
S5 TSOT-23 0302 REV B
Rev. A