Environmental Reliability Requirements; Table 5. Atx Reference Thermal Solution Environmental Reliability Requirements - Intel 4 Series Thermal/Mechanical Design Manuallines

Reference Thermal Solution
4.4

Environmental Reliability Requirements

The environmental reliability requirements for the reference thermal solution are
shown in Table 5 and Table 6. These should be considered as general guidelines.
Validation test plans should be defined by the user based on anticipated use
conditions and resulting reliability requirements.
The ATX testing will be performed with the sample board mounted on a test fixture
and includes a processor heatsink with a mass of 550g. The test profiles are
unpackaged board level limits.

Table 5. ATX Reference Thermal Solution Environmental Reliability Requirements

(Board Level)
Test
Mechanical
Shock
Random
Vibration
Thermal
Cycling
Humidity
NOTES:
1.
2.
The current plan for BTX reference solution testing is to mount the sample board
mounted in a representative BTX chassis with a thermal module assembly having a
mass of 900g. The test profiles are unpackaged system level limits.
29
1
• 3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops).
• Profile: 50 G, Trapezoidal waveform, 4.3 m/s
[170 in/s] minimum velocity change
• Duration: 10 min/axis, 3 axes
• Frequency Range: 0.01 g2/Hz @ 5Hz ramping to
0.02 g2/Hz @20 Hz, 0.02 g2/Hz @ 20 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 g RMS
• Non-Operating, -40 °C to +70 °C
• 85 % relative humidity / 55 °C
The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
Additional Pass/Fail Criteria may be added at the discretion of the user.
Requirement
Thermal and Mechanical Design Guidelines
Pass/Fail
2
Criteria
Visual\Electrical
Check
Visual/Electrical
Check
Thermal
Performance
Visual Check