Audio Reference Design; Audio Schematics; Audio Layout; Handling And Soldering Guidelines - Enfora Enabler LPP G Integration Manual

4.5.2. Audio Reference Design

The audio quality is very dependent on the circuit design and layout. As an aid to obtaining good
audio quality, a reference design has been included below. It has been proven to provide good
performance on the SDK module.

4.5.2.1. Audio Schematics

4.5.2.2. Audio Layout

Layout plots for the audio section of the SDK are available upon request.

4.6. Handling and Soldering Guidelines

The guidelines presented in IPC/JEDEC J-STD-020C for handling, preparation, and reflow of
lead-free devices should be applied to the Enabler LPP G module. Care should be taken to
minimize module moisture exposure before reflow. The module is classified as a Type 3 MSL
(moisture sensitivity level).
Additional information forthcoming
LPP0108IG001

Figure 5 - Audio Reference Design Schematic

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Version - Preliminary – 06/20/08