4.5.1. Advanced tips for an RF friendly layout
4.5.1.1. Ground Plane
To ensure the lowest possible EMI emissions and maximum thermal conductivity, it is
recommended that all metal tabs on the GSM module shield must be soldered down onto a
continuous ground plane that runs under the entire module. Ample ground vias should be
provided to create a low impedance ground. It is recommended to minimize the number of
I/O and power traces under the GSM module to allow for as much ground plane as possible.
An example of a good ground structure and pad layout is shown below in Figure 1 - Example
of good ground plane for GSM modules.
Figure 1 - Example of good ground plane for GSM modules
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Version - Preliminary – 06/20/08
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