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6.4 Thermal integration guidelines (TBC)
Thermal integration guidelines (TBC)
The local maximum ambient air temperature (T
The local maximum ambient air temperature (T
dissipation system (example: heatsink)
(θsa is the thermal resistance thermal dissipation system to ambient)
thermal resistance thermal dissipation system to ambient)
Thermal interface materials (TIM), which are used between the thermal dissipation system and the
Thermal interface materials (TIM), which are used between the thermal dissipation system and the
Thermal interface materials (TIM), which are used between the thermal dissipation system and the
interface casing, can be of many kinds, including greases, gels, adhesives, tapes, silicon rubber
interface casing, can be of many kinds, i
materials, and special thermoplastic adhesives.
materials, and special thermoplastic adhesives.
Thermal dissipation system can be attached directly to the interface casing with using M3 hole
Thermal dissipation system can be attached directly to the interface casing with using M3 hole
Thermal dissipation system can be attached directly to the interface casing with using M3 hole
fixation on the top of casing.
7 Available Tools
7.1 Workbench
amb max
heatsink) with:
θ θ θ θ sa ≤ ≤ ≤ ≤ 1 °C/W
ncluding greases, gels, adhesives, tapes, silicon rubber
Confidential Information
Ref: OEM-2012-149
= 85°C) can be supported by thermal
= 85°C) can be supported by thermal
34/39
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