Cooling Fan; Low Voltage Tests; Safety Tests; Semiconductor Installation - Kemppi Minarc Evo 150 Service Manual

Service manual Minarc Evo 150 and 180 Version 1.3 30.9.2015

4.3.3. Cooling fan

Cooling fan gets the power from the +24VDC line. Voltage can be measured in the X7 connector (X7-1
+24VDC and X7-2 GND). Note that the cooling fan has delayed starting.
The cooling fan is installed so that the air flows from the left side plate to Z001 card. Air comes out
through the front and the back plate grills.

4.3.4. Low voltage tests

Low voltage test cannot be done to Minarc Evo 150 machine.

4.3.5. Safety tests

Safety tests are made normally, but PE conductivity test cannot be tested, because there are no outer
parts connected to PE. Do not use PE continuity test equipment with high testing current.
PE wire conductivity should be measured only by DMM with resistance function to continuity. Measure
the resistance between the main supply cable terminal and Z001 X3.

4.4. Semiconductor installation

It is a must be to use torque screwdriver
while tightening any power components onto the heat
sink. See following sections for tightening torques.

4.4.1. Rectifier/PFC module and IGBT

MinarcEvo 150/180 has soldered input rectifier/PFC and IGBT modules and it is not possible to change
them separately. Only reliable way to replace the module(s) is to change the whole Z001 main circuit
card.
The heat sink paste should be spread on to the modules in an even layer by using fingers. Then the card
should be immediately mounted onto the heat sink, this minimizes the possibility of any contamination
(dirt etc.) getting between the components.
Hexagonal screw
Support cap Support cap screw
The hexagonal fixing screws for the IGBT module are tightened (stage 1) to 1 Nm. And after few minutes
the module screws can be finally tightened (stage 2) to a torque of 2,0 Nm.
Once all four hexagonal screws are tightened to right torque, the module support cap screws can be
fastened. The idea is to support the module to the PCB with the plastic caps, instead of the component
soldered legs. The torx screws for caps can be tightened only up to 0,5 Nm, or otherwise PCB may bend.
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