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−X−
A
8
5
B
1
4
−Y−
G
−Z−
H
D
0.25 (0.010)
Z
M
NCP1201
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AG
0.25 (0.010)
Y
S
M
M
C
N
X 45
SEATING
PLANE
0.10 (0.004)
Y
X
S
S
SOLDERING FOOTPRINT*
7.0
0.275
0.6
0.024
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
NOTES:
K
_
M
J
1.52
0.060
4.0
0.155
1.270
0.050
mm
SCALE 6:1
inches
18
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
4.80
5.00
0.189
0.197
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.053
0.069
D
0.33
0.51
0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25
0.004
0.010
J
0.19
0.25
0.007
0.010
K
0.40
1.27
0.016
0.050
_
_
_
M
0
8
0
N
0.25
0.50
0.010
0.020
S
5.80
6.20
0.228
0.244
_
8
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