Advertisement
A
L
6
5
4
S
1
2
3
G
0.05 (0.002)
H
0.075
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NCP1215
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE M
B
D
J
C
K
SOLDERING FOOTPRINT*
2.4
0.094
0.95
0.037
1.9
0.95
0.037
http://onsemi.com
15
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
MILLIMETERS
DIM
MIN
A
2.90
M
B
1.30
C
0.90
D
0.25
G
0.85
H
0.013
J
0.10
K
0.20
L
1.25
_
M
0
S
2.50
0.7
0.028
1.0
0.039
mm
SCALE 10:1
inches
INCHES
MAX
MIN
MAX
3.10
0.1142 0.1220
1.70
0.0512 0.0669
1.10
0.0354 0.0433
0.50
0.0098 0.0197
1.05
0.0335 0.0413
0.100
0.0005 0.0040
0.26
0.0040 0.0102
0.60
0.0079 0.0236
1.55
0.0493 0.0610
_
_
_
10
0
10
3.00
0.0985 0.1181
Advertisement
