ON Semiconductor NCS36000 Operating Manual

Passive infrared (pir) detector controller

Advertisement

Quick Links

NCS36000
Passive Infrared (PIR)
Detector Controller
The NCS36000 is a fully integrated mixed−signal CMOS device
designed for low−cost passive infrared controlling applications. The
device integrates two low−noise amplifiers and a LDO regulator to
drive the sensor. The output of the amplifiers goes to a window
comparator that uses internal voltage references from the regulator.
The digital control circuit processes the output from the window
comparator and provides the output to the OUT and LED pin.
Features
3.0 − 5.75 V Operation
−40 to 85°C
14 Pin SOIC Package
Integrated 2−Stage Amplifier
Internal LDO to Drive Sensor
Internal Oscillator with External RC
Single or Dual Pulse Detection
Direct Drive of LED and OUT
This is a Pb−Free Device
Typical Applications
Automatic Lighting (Residential and Commercial)
Automation of Doors
Motion Triggered Events (Animal photography)
LDO &
VREF
6
Voltage References
OP1_P
5
OP1_N
4
Amplifier
OP1_O
3
Circuit
OP2_N
2
OP2_O
1
System
OSC
13
Oscillator
Figure 1. Simplified Block Diagram
© Semiconductor Components Industries, LLC, 2015
December, 2015 − Rev. 3
2
Digital
2
Window
Control
Comparator
Circuit
1
www.onsemi.com
14
1
SOIC−14
D SUFFIX
CASE 751A
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
PIN CONNECTIONS
OP2_O
1
2
OP2_N
3
OP1_O
4
OP1_N
5
OP1_P
6
VREF
7
VSS
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
12 MODE
10 xLED_EN
9 LED
8 OUT
MARKING
DIAGRAM
14
NCS36000G
AWLYWW
1
14
VDD
OSC
13
MODE
12
NC
11
xLED_EN
10
LED
9
OUT
8
Publication Order Number:
NCS36000/D

Advertisement

Table of Contents
loading

Summary of Contents for ON Semiconductor NCS36000

  • Page 1 NCS36000 Passive Infrared (PIR) Detector Controller The NCS36000 is a fully integrated mixed−signal CMOS device designed for low−cost passive infrared controlling applications. The device integrates two low−noise amplifiers and a LDO regulator to www.onsemi.com drive the sensor. The output of the amplifiers goes to a window comparator that uses internal voltage references from the regulator.
  • Page 2: Pin Function Description

    NCS36000 PIN FUNCTION DESCRIPTION Pin No. Pin Name Description OP2_O Output of second amplifier OP2_N Inverting input of second amplifier OP1_O Output of first amplifier OP1_N Inverting input of first amplifier OP1_P Non−inverting input of first amplifier VREF Regulated voltage reference to drive sensor Analog ground reference.
  • Page 3: Operating Ranges

    NCS36000 OPERATING RANGES (Note 6) Rating Symbol Unit Analog Power Supply 5.75 Analog Ground Reference Supply Current (Standby, No Loads) 170m Digital Inputs (MODE) 0.7 * 0.28 Digital Output (OUT, LED) Push−Pull Output (10 mA Load) 0.67 * OP1_P (Sensor Input) (Note 7) AMP 1 IN −...
  • Page 4: Applications Information

    NCS36000 APPLICATIONS INFORMATION Oscillator digital signal processing. The cutoff frequencies and The oscillator uses an external resistor and capacitor to set passband gain are set by the external components. See the system clock frequency. Multiple clock frequencies can Figure 5.
  • Page 5 NCS36000 VREF 6 − VREF Comp_P OP2_O − − − Comp_N Sensor dependent components Application dependent components Figure 5. Figure Showing Simplified Block Diagram of Analog Conditioning Stages Digital Signal Processing Block (all times assume a The third function of the digital signal processing block is 62.5 Hz system oscillator frequency)
  • Page 6 OP1_N OP1_P xLED_EN VREF Microcontroller Sensor dependent components Figure 8. Typical Application Diagram Using NCS36000 C1 = 33 mF R1 = 10 kW J1 (Jumper for xLED_EN) R2 = 560 kW C2 = 10 nF J2 (Jumper for Mode Select)
  • Page 7: Ordering Information

    NCS36000 ORDERING INFORMATION † Device Package Shipping NCS36000DG SOIC−14 55 Units / Rail (Pb−Free) NCS36000DRG SOIC−14 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
  • Page 8: Package Dimensions

    PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.

Table of Contents