Package Dimensions - ON Semiconductor MC33067 Manual

High performance resonant mode controllers
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16
1
H
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−A−
9
B
8
F
C
S
−T−
K
G
D
16 PL
0.25 (0.010)
M
T
A
MC34067, MC33067

PACKAGE DIMENSIONS

PDIP−16
P SUFFIX
CASE 648−08
ISSUE T
L
SEATING
PLANE
M
J
M
http://onsemi.com
15
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
_
_
_
_
M
0
10
0
10
S
0.020
0.040
0.51
1.01

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