Sony HDVF-C30W Maintenance Manual page 27

Data write procedure
Data write procedure in the PLD is outlined below.
For details of data write procedure, refer to "Download
Tool Operating Instruction for Device Programming"
which is available in the same site where the PLD Down-
load Tool software is available.
1. Prepare the Project file.
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Download the Project file from the Sony Database
Server.
2. Push the RELEASE knob and remove the viewfinder
barrel. (Refer to Section 1-7-2, step 1.)
3. Perform steps 1 to 3 of "1-7-1. Replacing the LCD
Panel."
4. Connect the camera to the connector (CN1) on the PR-
267 board using the connecting cable.
5. Turn off the power of the camera. Connect the PC
parallel port to the EPR connector of the target board
(CN4/PR-267 board) using the PLD download tool
cable.
CN4
PR-267 board
6. Turn on the power of the camera.
Start the Download Tool software and read the Project
file.
7. Program the PLD with the Download Tool software.
8. Upon completion of programming, check that error
message is not displayed. Turn off the power of the
camera and back on.
HDVF-C30W
CN1
1-14. Notes on Repair Parts
1. Safety Related Components Warning
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Components marked ! are critical to safe operation.
Therefore, specified parts should be used in the case of
replacement.
2. Standardization of Parts
Some repair parts supplied by Sony differ from those
used for the unit. These are because of parts common-
ality and improvement.
Parts list has the present standardized repair parts.
3. Stock of Parts
Parts marked with "o" at SP (Supply Code) column of
the spare parts list may not be stocked. Therefore, the
delivery date will be delayed.
4. Harness
Harnesses with no part number are not registered as
spare parts.
In need of repair, get components shown in the list and
repair using them.
1-15. Unleaded Solder
Boards requiring use of unleaded solder are printed with a
lead free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come
printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
m
. Be sure to use the unleaded solder for the printed circuit
board printed with the lead free mark.
. The unleaded solder melts at a temperature about 40 d
higher than the ordinary solder, therefore, it is recom-
mended to use the soldering iron having a temperature
regulator.
. The ordinary soldering iron can be used but the iron tip
has to be applied to the solder joint for a slightly longer
time. The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful.
1-21 (E)