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Thermal Considerations
The PMC-PARALLEL-TTL design consists of CMOS circuits. The power dissipation due
to internal circuitry is very low. It is possible to create a higher power dissipation with the
externally connected logic. If more than one Watt is required to be dissipated due to
external loading then forced air cooling is recommended. With the one degree
differential temperature to the solder side of the board external cooling is easily
accomplished.
Embedded Solutions
Page 32
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