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Philips Semiconductors
12. Package outline
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
1
Z
DIMENSIONS (mm are the original dimensions)
A
2
UNIT
A
A
3
max.
18.5
8.7
mm
3.7
17.8
8.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT111-1
Fig 10. Package outline SOT 111-1 (DBS9MPF)
9397 750 14728
Product data sheet
D
D
1
q
P
P
1
pin 1 index
e
b
2
A
b
b
b
c
4
1
2
15.5
1.40
0.67
1.40
0.48
15.1
1.14
0.50
1.14
0.38
REFERENCES
IEC
JEDEC
q
1
9
b
w
M
b
1
0
5
scale
(1)
(1)
D
D
E
e
e
1
2
21.8
21.4
6.48
2.54
2.54
21.4
20.7
6.20
JEITA
Rev. 02 — 28 April 2005
TDA6107AJF
Triple video output amplifier
A
3
q
2
A
A
4
c
L
10 mm
L
P
P
Q
q
1
3.9
2.75
3.4
1.75
15.1
3.4
2.50
3.2
1.55
14.9
EUROPEAN
PROJECTION
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SOT111-1
A
2
Q
E
e
2
(1)
Z
q
q
w
1
2
max.
o
65
4.4
5.9
0.25
1
o
4.2
5.7
55
ISSUE DATE
95-03-11
03-03-12
12 of 16
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