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General Handling Recommendations for the
The following list provides a few guidelines for package handling:
•
Handle the electrostatic discharge sensitive (ESD) package with care before, during, and after
processing.
•
Do not apply any load to exceed 3 Kg after assembly.
•
Components should not be hot-dip tinned.
•
The package encapsulation is an acrylated urethane. Use adequate ventilation (local exhaust) for all
elevated temperature processes.
The package parameters are as follows:
Heat sink adhesive
IBM reference drawing
Test socket
Signal
Power/ground
Total
A.1 Package Environmental, Operation, Shipment,
and Storage Requirements
The environmental, operation, shipment, and storage requirements are as follows:
•
Make sure that the package is suitable for continuous operation under business office environments.
— Operating environment: 10 °C to 40 °C, 8% to 80% relative humidity
— Storage environment: 1 °C to 60 °C, up to 80% relative humidity
— Shipping environment: 40 °C to 60 °C, 5% to 100% relative humidity
•
This component is qualified to meet JEDEC moisture Class 2.
After expiration of shelf life, packages may be baked at 120 °C (+10/–5 °C) for 4 hours minimum
and then be used or repackaged. Shelf life is as specified by JEDEC for moisture Class 2
components.
A.2 Card Assembly Recommendations
This section provides recommendations for card assembly process. Follow these guidelines for card
assembly.
•
This component is supported for aqueous, IR, convection reflow, and vapor phase card assembly
processes.
The temperature of packages should not exceed 220 °C for longer than 5 minutes.
•
•
The package entering a cleaning cycle must not be exposed to temperature greater than that
occurring during solder reflow or hot air exposure.
•
It is not recommended to re-attach a package that is removed after card assembly.
603 Hardware Specifications
Appendix A
C4-CQFP Package
AIEG-7655
99F4869
Yamaichi QFP-PO 0.5-240P
165
75
240
29
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