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Table 2 provides the recommended operating conditions for the 603.
Characteristic
Core supply voltage
PLL supply voltage
Input voltage
Die-junction temperature
Notes : These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
Table 3 provides the package thermal characteristics for the 603.
Motorola wire-bond CQFP package die junction-to-case thermal resistance (typical)
IBM C4-CQFP package die junction-to-heat sink base thermal resistance (typical)
Note: Refer to Section 1.8, "System Design Information," for more details about thermal management.
Table 4 provides the DC electrical characteristics for the 603.
Vdd = 3.3 ± 5% V dc, GND = 0 V dc, 0 ≤ T
Input high voltage (all inputs except SYSCLK)
Input low voltage (all inputs except SYSCLK)
SYSCLK input high voltage
SYSCLK input low voltage
Input leakage current, V
in
V
in
Hi-Z (off-state) leakage current, V
Output high voltage, I
OH
603 Hardware Specifications
Table 2. Recommended Operating Conditions
Table 3. Package Thermal Characteristics
Characteristic
Table 4. DC Electrical Specifications
≤ 105 ° C
j
Characteristic
= 3.465 V
= 5.5 V
=
3.465 V
in
=
V
5.5 V
in
= –9
mA
Symbol
Value
Vdd
3.135 to 3.465
AVdd
3.135 to 3.465
V
–0.3 to 5.5
in
T
0 to 105
j
Symbol
V
IH
V
IL
CV
IH
CV
IL
I
in
I
in
I
TSI
I
TSI
V
OH
Unit
V
V
V
° C
Symbol
Value
Rating
θ
° C/W
2.2
JC
θ
° C/W
1.1
JS
Min
Max
Unit
Notes
2.2
5.5
V
GND
0.8
V
2.4
5.5
V
GND
0.4
V
µ A
—
10
1
µ A
—
TBD
1
µ A
—
10
1
µ A
—
TBD
1
2.4
—
V
5
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