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1 . 5
1
0 . 5
0
0
Figure 15. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
Thermagon Inc.
3256 West 25th Street
Cleveland, OH 44109-1668
603 Hardware Specifications
1 0
2 0
3 0
Contact Pressure
Contact Pressure (psi)
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
4 0
5 0
6 0
(psi)
517-496-4000
617-935-4850
216-741-7659
7 0
8 0
25
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