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1.7.1.2 Mechanical Dimensions of the Motorola Wire-Bond CQFP Package
Figure 10 shows the mechanical dimensions for the Motorola wire-bond CQFP package.
F
*Reduced pin count shown for clarity. 60 pins per side
Pin 240
Pin 1
D
*Not to scale
Figure 10. Mechanical Dimensions of the Motorola Wire-Bond CQFP Package
18
–H–
A
B
E
Die
G
C
J
A
B
C
D
E
F
G
H
J
AA
AB
θ1
θ2
R
Notes:
1. BSC—Between Standard Centers.
2. All measurements in mm.
Wire Bonds
603 Hardware Specifications
AB
θI
R
θ2
R
H
AA
Min.
Max.
30.86
31.75
34.6 BSC
3.75
4.15
0.5 BSC
0.18
0.30
3.10
3.90
0.13
0.175
0.45
0.55
0.25
–
1.80 REF
0.95 REF
2°
6°
1°
7°
0.15 REF
Ceramic Body
Alloy 42 Leads
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