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3
2
1
Item Component description
1
COM Express module
2
DDR2 memory module
3
Active heatsink
4
Backer plate (supplied with four M2 flat head screws)
5
Phase-change thermal interface material, Thermstrate
TC
6
Standoffs (use with items 8 and 9)
Figure 1. Basic component preparation
4
5
Item Component description
7
Heatsink spacer and module screw
8
Heatsink screws
9
Washers (use with item 8)
10
Carrier screws
11
CR100 FlexATX carrier board
®
6
7
8
9
10
11
5
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