Locations Of Key Components And Connectors - Lenovo System x3630 M4 Product Manual

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Intel Intelligent Power Capability powers individual processor elements on and off as needed, to
reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 19% less energy compared to 1.5 V DDR3
RDIMMs.
Solid state drives (SSDs) consume as much as 80% less power than traditional spinning HDDs.
The server uses hexagonal ventilation holes, a part of Calibrated Vectored Cooling™ technology.
Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification and
management to help achieve lower heat output and reduced cooling needs.

Locations of key components and connectors

The following figure shows the front of the server with eight 3.5-inch drive bays.
Figure 2. Front view of the System x3630 M4 with eight drive bays
The following figure shows the front of the server with twelve 3.5-inch drive bays.
Figure 3. Front view of the System x3630 M4 with twelve drive bays
System x3630 M4 (E5-2400 v2)
4

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