Locations Of Key Components And Connectors - Lenovo x3500 M5 Product Manual

The Intel Xeon processor E5-2600 v3 product families offer significantly better performance over the
previous generation while fitting into the same thermal design power (TDP) limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed to
reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.2 V DDR4 memory DIMMs use up to 20% less energy compared to 1.35 V DDR3
DIMMs.
SSDs use as much as 80% less power than traditional spinning 2.5-inch HDDs.
The server uses hexagonal ventilation holes, which is a part of Calibrated Vectored Cooling™
technology. Hexagonal holes can be grouped more densely than round holes, which provides more
efficient airflow through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification
and management to help achieve lower heat output and reduced cooling needs.

Locations of key components and connectors

The following figure shows the front of the server.
Figure 2. Front view of the System x3500 M5
The following figure shows the rear of the server.
Lenovo System x3500 M5 4