Locations Of Key Components And Connectors - Lenovo System x3650 M4 BD Product Manual

Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 19% less energy compared to 1.5 V DDR3
RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning HDDs.
The server uses hexagonal ventilation holes, a part of Calibrated Vectored Cooling™ technology.
Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification
and management to help achieve lower heat output and reduced cooling needs.

Locations of key components and connectors

The following figure shows the front of the server.
Figure 2. Front view of the System x3650 M4 BD
The following figure shows the rear of the server.
Figure 3. Rear view of the System x3650 M4 BD
The following figure shows the locations of key components inside the server.
System x3650 M4 BD 4