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UM023 FMC230 User Manual
6.3 Cooling
Two different types of cooling are available for the FMC.
6.3.1 Convection cooling
The air flow provided by the fans of the chassis the FMC is enclosed in will dissipate the heat
generated by the on board components. A minimum airflow of 300 LFM is recommended.
For standalone operations (such as on a Xilinx development kit), it is highly recommended to
blow air across the FMC and ensure that the temperature of the devices is within the allowed
range. 4DSP's warranty does not cover boards on which the maximum allowed temperature
has been exceeded.
6.3.2 Conduction cooling
In demanding environments, the ambient temperature inside a chassis could be close to the
operating temperature defined in this document. It is very likely that in these conditions the
junction temperature of power consuming devices will exceed the operating conditions
recommended by the device manufacturers (mostly +85
coupled with sufficient air flow might be sufficient to maintain the temperature within operating
boundaries, some active cooling would yield better results and would certainly help with
resuming operations much faster in the case the devices were disabled because of a
temperature "over range".
7 Safety
This module presents no hazard to the user.
8 EMC
This module is designed to operate within an enclosed host system built to provide EMC
shielding. Operation within the EU EMC guidelines is not guaranteed unless it is installed
within an adequate host system. This module is protected from damage by fast voltage
transients originating from outside the host system which may be introduced through the
system.
UM023
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