HP ZBook 15 G2 Mobile Workstation Maintenance And Service Manual page 90

4. Remove the fan/heat sink assembly (4).
NOTE:
assembly and the system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the fan/heat sink assembly, processor, and system board spare part kits.
●
Various thermal pads are used on the graphics board components (1) and (7) and the heat sink sections
(2) and (8) that service them
● Thermal paste is used on the processor (3) and the heat sink section (4) that services it
● Thermal paste is used on the graphics board processor (5) and the heat sink section (6) that services it
82 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
Due to the adhesive quality of the thermal material located between the fan/heat sink