Toshiba RAS-M10PKVP-E Service Manual page 137

No. Part name
∗ Bind TS sensor, TE sensor and TO sensor with the bundling
19 Sensor
wiring band.
process ∗ Pass TE sensor and TO sensor through upper part of the
(Continued)
inverter fixing board and then bind them with the bundling
band.
NOTE
Using the bundling band being on the market, be sure to bind
the position which was bound.
Procedure
– 137 –
Remarks
Inverter fixing board
Bundling band Bundling band
TS sensor TE sensor
TE sensor TO sensor
TO sensor