HP Pavilion g4 Maintenance And Service Manual page 80

4. Remove the fan and heat sink (4).
NOTE:
and the system board components each time the heat sink is removed. Replacement
thermal material is included with the base enclosure, heat sink, processor, and system board
spare part kits.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it (only on computer models equipped with a graphics subsystem with switchable
discrete memory)
1. If it is necessary to replace the fan, turn the fan and heat sink upside down with the fan
toward you.
2. Remove the two Phillips M1.5 × 2.5 screws (1) that secure the fan to the heat sink.
72 Chapter 4 Removal and replacement procedures
The thermal material must be thoroughly cleaned from the surfaces of the heat sink