Processor Upgrading; Memory Subsystem - HP dx7300 Technical Reference Manual

Processor/Memory Subsystem

3.2.2 Processor Upgrading

All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the
processor use an integrated heatsink/fan assembly. A replacement processor must use the same
type heatsink/fan assembly as the original to ensure proper cooling.
The processor uses a PLGA775 package consisting of the processor die mounted "upside down"
on a PC board. This arrangement allows the heat sink to come in direct contact with the processor
die. The heat sink and attachment clip are specially designed provide maximum heat transfer
from the processor component.
CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment
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of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal
conditions and automatically shut down, such a condition could still result in damage to the processor
component. Refer to the applicable Service Reference Guide for processor installation instructions.
CAUTION: Installing a processor that is not supported by the system board may cause damage to the
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system board and/or the processor. Processors rated above 95 watts are not recommended.

3.3 Memory Subsystem

All models support non-ECC PC2-5300 and PC2-6400 DDR2 memory. The USDT form factor
supports up to 3 gigabytes of memory while the SFF, ST, MT, and CMT form factors support up
to 4 gigabytes of memory.
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The DDR SDRAM "PCxxxx" reference designates bus bandwidth (i.e., a PC2-5300 DIMM can,
operating at a 667-MHz effective speed, provide a throughput of 5300 MBps (8 bytes ×
667MHz)). Memory speed types may be mixed within a system, although the system BIOS will
set the memory controller to work at speed of the slowest DIMM.
The system board provides three or four DIMM sockets depending on form factor:
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XMM1, channel A
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XMM2, channel A
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XMM3, channel B
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XMM4, channel B (not present inUSDT form factor)
DIMMs do not need to be installed in pairs although installation of pairs (an equal DIMM for
each channel) provides the best performance. The XMM1 socket must be populated for proper
support of Intel Advanced Management Technology (AMT). The BIOS will detect the DIMM
population and set the system accordingly as follows:
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Single-channel mode - DIMMs installed for one channel only
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Dual-channel asymetric mode - DIMMs installed for both channels but of unequal channel
capacities.
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Dual-channel interleaved mode (recommended)- DIMMs installed for both channels and
offering equal channel capacities, proving the highest performance.
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