Quality And Reliability Requirements; Use Conditions; Use Conditions Environment (System Level) - Intel BX80619I73820 Design Manual

Quality and Reliability Requirements

9
Quality and Reliability
Requirements
9.1

Use Conditions

Intel evaluates reliability performance based on the use conditions (operating
environment) of the end product by using acceleration models.
The use condition environment definitions provided in
based on speculative use condition assumptions, and are provided as examples only.
Based on the system enabling boundary condition, the solder ball temperature can vary
and needs to be comprehended for reliability assessment.
Table 9-1.

Use Conditions Environment (System Level)

Use Environment
Slow small internal
gradient changes due to
external ambient
(temperature cycle or
externally heated)
Fast, large gradient
on/off to max operating
temp.
(power cycle or
internally heated
including power save
features)
High ambient moisture
during low-power state
(operating voltage)
High Operating
temperature and short
duration high
temperature exposures
Thermal/Mechanical Specifications and Design Guide
Speculative Example Use
Stress Condition Condition
DT = 35–44 °C
Temperature Cycle
(solder joint)
T = 25–30 °C
THB/HAST 85%RH
(ambient)
T = 95–105 °C
Bake
(contact)
Table 9-1 and Table 9-2
Example 7-Yr Example 10-Yr
Stress Equiv. Stress Equiv.
550–930 cycles 780–1345 cycles
Temp Cycle Temp Cycle
(-25 °C to 100 °C) (-25 °C to 100 °C)
110–220 hrs at
145–240 hrs at
110 °C 85%RH
110 °C 85%RH
700–2500 hrs at 800–3300 hrs at
125 °C
are
125 °C
105