Agilent Technologies Infiniium 90000 A Service Manual page 81

Timebase Test Group
• Timebase Interpolator Test - This test validates the timebase interpolator hardware by
verifying that it is able to produce unique values for different trigger settings. If this test fails,
there may be a problem with the timebase interpolator IC located on the backplane board.
However, this test has many other hardware dependencies so a failure from this test cannot
necessarily be associated with any specific hardware failure. Try replacing the backplane board
and see if the test will then pass.
• Board Level Repair - Re-solder or replace the Calisto timebase interpolator IC. If this does not fix
the failure, report the error to the Infiniium software team.
ADC Test Group
• ADC Register Test - This test verifies that all of the ADC registers can be correctly written to
and read from. If the test reads any registers whose values are not equal to what they were
written to, it will report a failure for the ADC on the associated channel.
• Board Level Repair - Re-solder or replace the ADC that is failing, If this does not fix the problem,
further hardware level debugging is necessary.
• ADC Voltage Test Points Test - This test verifies that voltages measured from 32 test points
within the Merlin ADC are within their expected range. If any test point is found to be outside
of its expected range, a failure is reported for the ADC containing the associated test point.
• Board Level Repair - The ADC with the associated errors must be replaced.
Acquisition Memory Test Group
• Hedwig MBIST - This test checks the embedded memory in each Hedwig memory controller
ASIC for errors. If the errors can be corrected using the redundancy present in the IC, the
software will perform the necessary correction.
• Board Level Repair - If the errors cannot be corrected, the Hedwig IC with the associate errors must
be replaced.
• Hedwig Register Test - This test verifies that all of the Hedwig memory controller ASIC registers
can be correctly written to and read from. If the test reads any registers whose values are not
equal to what they were written to, it will report a failure for the Hedwig with the associated
error.
• Board Level Repair - The Hedwig IC with the associated errors must be re-soldered or replaced.
• Hedwig-DDR Addr & Data Test - This is a fast, condensed check of the DDR2 acqusition
memory system. The test uses a complex algorithm to isolate failures with specific address or
data lines connecting the Hedwig-DDR2 memory ICs. If there are problems with the control
lines connecting the Hedwig-DDR2 ICs or problems with the ICs themselves, many address
and data line failures may be reported incorrectly. If there are only a few address and data
line failures reported, it can be assumed with fairly high confidence that the reported failures
are accurate. If any errors are found, diagnostic information is reported containing the specific
address or data lines that may be causing the failures as well as the channel number and the
schematic part identification number associated with the specific ICs causing the failure.
• Board Level Repair - The failures could be associated with either the Hedwig memory controller
IC, the DDR2 memory IC(s), or with the address, data, or control lines connecting them. If the
test reports failures for most (or all) of the address and data lines associated with a particular
Hedwig IC, the failure is most likely associated with one of the control lines connecting the Hedwig
to its DDR2 memory ICs. The problem could be with the solder connections between the ICs and
the traces connecting them, the individual board traces, or the IC(s) themselves. First, attempt to
simply remove and re-solder the suspect ICs. If this does not fix the failures, the problem is most
likely with the IC(s). Replace the ICs associated with the reported failures.
Acquisition/Backplane Assembly Trouble Isolation - Scope Self Tests
Chapter 4: Troubleshooting
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