Thermal Specifications; Package Thermal Specifications - Intel E5310 - Xeon 1.6 GHz 8M L2 Cache 1066MHz FSB LGA771 Active Quad-Core Processor Datasheet

Thermal Specifications

6
Thermal Specifications
6.1

Package Thermal Specifications

The Quad-Core Intel® Xeon® Processor 5300 Series requires a thermal solution to
maintain temperatures within its operating limits. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design
Guidelines.
Note: The boxed processor will ship with a component thermal solution. Refer to
details on the boxed processor.
6.1.1 Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (T
Table 6-1
Table 6-3
Thermal solutions not designed to provide this level of thermal capability may affect the
long-term reliability of the processor and system. For more details on thermal solution
design, please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Thermal/
Mechanical Design Guidelines.
The Quad-Core Intel® Xeon® Processor 5300 Series implement a methodology for
managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor's Platform Environment Control Interface (PECI) bus as described in
Section 6.3. The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see
implement fan speed control must be designed to use this data. Systems that do not
alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
The Quad-Core Intel® Xeon® Processor E5300 Series (see
supports a single Thermal Profile. For these processors, it is expected that the Thermal
Control Circuit (TCC) would only be activated for very brief periods of time when
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
) specifications as defined by the applicable thermal profile (see
CASE
and Figure 6-1 for Quad-Core Intel® Xeon® Processor E5300 Series and
and Figure 6-2 for Quad-Core Intel® Xeon® Processor X5300 Series).
Section 6.2, Processor Thermal Features). Systems that
Figure
Section 8 for
6-1; Table 6-2)
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