Figure 7-31. Thermocouple Placed Into Groove; Figure 7-32. Removing Excess Solder - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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Also See for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN:
- Datasheet (100 pages) ,
- Design manual (126 pages)
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Case Temperature Reference Metrology
Figure 7-31. Thermocouple placed into groove
29. Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (Figure 7-32).
Figure 7-32. Removing Excess Solder
Note: Take usual precautions when using open blades
30. Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
Thermal and Mechanical Design Guidelines
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