Figure 7-33. Filling Groove With Adhesive; Figure 7-34. Application Of Accelerant - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (Figure 7-33).
Figure 7-33. Filling Groove with Adhesive
32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (Figure 7-34).
Figure 7-34. Application of Accelerant
100
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
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