Figure 7-38. System Airflow Illustration With System Monitor Point Area Identified - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual

Thermal and mechanical design guidelines
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The thermal sensor location and elevation are reflected in the Flotherm thermal model
airflow illustration and pictures (see Figure 7-38 and Figure 7-39).The Intel Boxed
Boards in the BTX form factor have implemented a System Monitor thermal sensor.
The following thermal sensor or its equivalent can be used for this function:
Part Number: C83274-002
BizLink USA Technology, Inc.
44911 Industrial Drive
Fremont, CA 94538 USA
(510)252-0786 phone
(510)252-1178 fax
sales@bizlinktech.com

Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified

104
Balanced Technology Extended (BTX) System Thermal Considerations
Power Supply
Unit
Memory
Part Number: 68801-0170
Molex Incorporated
2222 Wellington Ct.
Lisle, IL 60532
1-800-78MOLEX phone
1-630-969-1352 fax
amerinfo@molex.com
Graphics
Add-In Card
Monitor Point
MCH
Thermal
Module
Thermal and Mechanical Design Guidelines
OM16791

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