Figure 7-28. View Through Lens At Solder Station; Figure 7-29. Moving Solder Back Onto Thermocouple Bead - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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Also See for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN:
- Datasheet (100 pages) ,
- Design manual (126 pages)
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Case Temperature Reference Metrology
24. You may need to move the solder back toward the groove as the IHS begins to
heat. Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (Figure 7-28 and Figure 7-29).
Figure 7-28. View Through Lens at Solder Station
Figure 7-29. Moving Solder back onto Thermocouple Bead
Thermal and Mechanical Design Guidelines
97
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