Intel E7500 Thermal Design Manual
  1. Manuals
  2. Brands
  3. Intel Manuals
  4. Computer Hardware
  5. E7500
  6. Thermal design manual

Intel E7500 Thermal Design Manual

Chipset memory controller hub (mch) thermal and mechanical design guidelines
Hide thumbs Also See for E7500:
Table of Contents

Advertisement

Quick Links

Download this manual
R
®
Intel
E7500/E7505 Chipset
Thermal Design Guide
®
Intel
E7500/E7505 Chipset Memory Controller Hub (MCH) Thermal
and Mechanical Design Guidelines
November 2002
Document Number: 298647-002

Advertisement

Table of Contents
loading

Related Manuals for Intel E7500

Summary of Contents for Intel E7500

  • Page 1 ® Intel E7500/E7505 Chipset Thermal Design Guide ® Intel E7500/E7505 Chipset Memory Controller Hub (MCH) Thermal and Mechanical Design Guidelines November 2002 Document Number: 298647-002...
  • Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, Intel Xeon and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

  • Page 3: Table Of Contents

    Thermal Interface Material ..............27 6.3.5 Heatsink Clip ..................27 6.3.6 Clip Retention Anchors................28 6.3.7 Board Level Component Keep-out Dimensions ........28 Reliability Guidelines .....................30 Appendix A: Thermal Solution Component Suppliers ................31 Appendix B: Mechanical Drawings......................33 ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...
  • Page 4 Table 2. Intel E7505 Chipset MCH Thermal Specifications..........15 Table 3. Reliability Guidelines....................30 Table 4. Complete Thermal Solution Kits ................31 Table 5. Extruded Heatsinks .....................31 Table 6. Interface Materials ....................32 Table 7. Attach Hardware ....................32 ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...
  • Page 5 • Added Intel -002 E7505 chipset specific information and re-titled November 2002 document • Updated E7500/E7505 chipset MCH thermal specifications • Removed 90°C Angle Attach Die Temperature Measurement Methodology • Updated Supplier Contact Information • All reference to T changed to T...
  • Page 6 This page is intentionally left blank. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 7: Introduction

    ® (ICH3-S) Datasheet. For the ICH4, refer to the Intel 82801DB I/O Controller Hub 4 (ICH4) Datasheet. Note: Unless otherwise specified, the term “MCH” refers to both the E7500 chipset MCH and E7505 chipset MCH. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 8: Design Flow

    Step 1: Thermal Simulation - Thermal Models - Thermal Model Users Guide Step 2: Heatsink Selection - Thermal Reference - Mechanical Reference Step 3: Thermal Validation - Thermal Testing Software - Software Users Guide Therm_Design_Proc ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 9: Definition Of Terms

    Maximum die temperature allows. This temperature is measured at the geometric case center of the top of the package die. Thermal Design Power. Thermal solutions should be designed to dissipate this target power level. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 10: Reference Documents

    ® Intel Xeon™ Processor with 512-KB L2 Cache and Intel E7500 Chipset Platform 298649 Design Guide ® Intel E7500 Chipset: E7500 Memory Controller Hub (MCH) Datasheet 290730 ® ® Intel Xeon™ Processor and Intel E7505 Chipset Platform Design Guide 251934 ®...

  • Page 11: Packaging Technology

    (P64H2) Datasheet. For information on the ICH3-S package, refer to the Intel 82801CA I/O ® Controller Hub 3 (ICH3-S) Datasheet. For information on the ICH4 package, refer to the Intel 82801DB I/O Controller Hub 4 (ICH4) Datasheet. Figure 2. MCH Package Dimensions (Side View) 1.940 ±...

  • Page 12: Figure 3. Mch Package Dimensions (Top View)

    ∅ ∅ ∅ ∅ 00.071 L C Metal Edge (n)x ∅ 0.790 ± 0.025 (n)x 0.025 Min MCH_Pkg_TopView NOTES: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5M–1982. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 13: Thermal Simulation

    Thermal Simulation Thermal Simulation Intel provides thermal simulation models of the MCH and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated system- level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM*”...
  • Page 14 Thermal Simulation This page is intentionally left blank. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 15: Thermal Specifications

    Thermal Specifications Case Temperature and Thermal Design Power The TDP specifications are provide in Table 1 for the E7500 chipset MCH and Table 2 for the E7505 chipset MCH. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solutions.
  • Page 16 Thermal Specifications This page is intentionally left blank. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 17: Thermal Metrology

    The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring the MCH die temperature. Section 5.1 provides guidelines on how to accurately measure the MCH die temperatures.

  • Page 18: Figure 4. 0 Angle Attach Methodology (Top View)

    NOTE: Not to scale. Figure 5. 0° Angle Attach Heatsink Modifications 1.3 mm (0.05 in.) (0.5 mm (0.02 in.) Depth) 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in.) Depth) Angle_Attach_Heatsink_Mod NOTE: Not to scale. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 19: Power Simulation Software

    L2 cache. The combination of the Xeon processor(s) with 512-KB L2 cache and the higher bandwidth capability of the E7500/E7505 chipsets enable new levels of system performance. To assess the thermal performance of the chipset MCH thermal solution under “worst-case realistic application”...
  • Page 20 Thermal Metrology This page is intentionally left blank. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 21: Reference Thermal Solutions

    Reference Thermal Solutions Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs of the E7500/E7505 chipset MCH at worst-case conditions. This chapter describes the overall requirements for the reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria.

  • Page 22: Figure 7. Reference Heatsink Volumetric Envelope For The Mch

    40 mm (1.6 in.) Keep-out Zone (Tall Heatsink) Above the Motherboard 28 mm (1.1 in.) (Short Heatsink) Motherboard 42.5 mm (1.67 in.) 42.5 mm (1.67 in.) 42.5 mm (1.67 in.) Heatsink_Volumetric_Envelope NOTE: Not to scale. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 23: Thermal Solution Assembly

    Appendix B. Appendix A contains vendor information for each thermal solution component. Figure 8. Reference Thermal Solution Assembly Anchored Heatsin Mechanical Thermal FC-BGA Solder-Down ref_therm_solution_assy ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 24: Figure 9. Reference Thermal Solution Assembly (Side View)

    Reference Thermal Solutions Figure 9. Reference Thermal Solution Assembly (Side View) Figure 10. Reference Thermal Solution (Top View) Ref_Thermal_Solution ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 25: Heatsink Orientations

    (Figure 11). Aligning the heatsink 45° relative to the airflow is acceptable but delivers reduced thermal performance. Figure 11. Preferred Heatsink Orientation Orthogonal Mean Air Flow Direction Incorrect Orientation Parallel M ean Correct Air Flow Direction heatsk_orient ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 26: Extruded Heatsink Profiles

    6.3.2 Extruded Heatsink Profiles The reference thermal solution uses an extruded heatsink for cooling the E7500/E7505 chipset MCH components. Figure 12 shows the heatsink profile. This document does not provide tolerance information. Check with your heatsink supplier for specific tolerances. Appendix A lists suppliers for the extruded heatsink.

  • Page 27: Mechanical Interface Material

    6.3.3 Mechanical Interface Material Intel recommends the use of a mechanical interface material to avoid cracking of the exposed die under loading. The interface material reduces mechanical loads experienced by the die. The reference thermal solution uses a picture frame gasket of 0.813 mm (0.032 in.) thick Poron* foam.

  • Page 28: Clip Retention Anchors

    6.3.6 Clip Retention Anchors For E7500/E7505 chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45°...

  • Page 29: Figure 16. Retention Mechanism Component Keep-Out Zones

    See Detail A (0.165) 0.100 Detail A 0.165 0.083 0.038 Plated Through Hole 0.173 0.345 0.200 0.100 2x 0.056 Trace Keepout Component Keepout 850_Keepout_Zone NOTES: 1. Dimensions are in inches. 2. Not to scale. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 30: Reliability Guidelines

    It is recommended that the above tests are performed on a sample size of at least 12 assemblies from 3 lots of material. Additional Pass/Fail Criteria may be added at the discretion of the user. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 31: Appendix A: Thermal Solution Component Suppliers

    Bob Hall Foxconn 503-693-3509x235 bhall@foxconn.com Harry Lin 714-739-5797 hlinack@aol.com CCI/ACK Alternate Pin Fin Heatsink Kit Monica Chih A13506-001 866-2-29952666x131 (43gm, 42 x 42 x 35 mm) monica_chih@ccic.com.tw Bob Hall Foxconn 503-693-3509x235 bhall@foxconn.com ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 32: Table 6. Interface Materials

    Foxconn bhall@foxconn.com Julia Jiang Solder-Down 408-919-6178 A13494-005 Foxconn Anchor juliaj@foxconn.com Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability. ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

  • Page 33: Appendix B: Mechanical Drawings

    Appendix B: Mechanical Drawings Appendix B: Mechanical Drawings This appendix contains the following drawings: • MCH Heatsink Assembly • MCH Heatsink Clip ® Intel E7500/E7505 Chipset MCH Thermal Design Guide...

This manual is also suitable for:

E7505

Table of Contents