Figure 7-41. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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Also See for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN:
- Datasheet (100 pages) ,
- Design manual (126 pages)
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Mechanical Drawings
Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 2
8
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
D
4X
6.00
4X
C
B
COMPONENT KEEP-OUT
A
ROUTING KEEP-OUT
8
Thermal and Mechanical Design Guidelines
7
6
DISCLOSED IN CONFIDENCE AND ITS CONT
OR WRITTEN CONSENT OF INTEL CORPORAT
BOARD SECONDARY SIDE
10.00
LEGEND
7
6
5
4
ENTS
ION.
COMPONENT VOLUMETRIC
KEEP-INS
SOCKET BALL 1
SOCKET & PROCESSOR
VOLUMETRIC KEEP-IN OUTLINE
ROUTING KEEP-OUTS
SOCKET BALL 1
(FAR SIDE)
SOCKET & PROCESSOR
VOLUMETRIC KEEP-IN
5
4
3
DWG. NO
SHT.
REV
C40819
2
3
DEPARTMENT
SIZE
CAGE CODE
DRAWING NUMBER
R
2200 MISSION COLLEGE BLVD.
C40819
D
P.O. BOX 58119
CORP.
TMD
SANTA CLARA, CA 95052-8119
SCALE: NONE
DO NOT SCALE DRAWING
3
2
1
D
C
B
A
REV
3
SHEET 2 OF 3
1
111
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