Reference Thermal Solutions; Operating Environment; Mechanical Design Envelope - Intel E7500 Design Manual

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Reference Thermal Solutions

Intel has developed a reference thermal solution designed to meet the cooling needs of the MCH at
worst-case conditions. This chapter describes the overall requirements for the reference thermal
solution, including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need thermal solutions, depending on specific system
local-ambient operating conditions. For information on the P64H2 thermal solutions, refer to the
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Intel 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines.
6.1

Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of
50 C. The minimum recommended airflow velocity at the heatsink is 200 lfm (linear feet per
minute). The approaching airflow temperature is assumed to be equal to the local-ambient
temperature. The thermal designer must carefully select the location to measure airflow to obtain
an accurate estimate. These local-ambient conditions are based on a 35 C external-ambient
temperature at sea level. (External-ambient refers to the environment external to the system.)
6.2

Mechanical Design Envelope

Though each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed on the
E7500 MCH thermal solution is shown in Figure 8.
When using heatsinks that extend beyond the MCH reference heatsink envelope shown in
Figure 8, any motherboard components placed between the heatsink and motherboard cannot
exceed 2.286 mm (0.090 in.) in height.
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Intel E7500 MCH Thermal and Mechanical Design Guidelines
Reference Thermal Solutions
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