Mechanical Interface Material; Thermal Interface Material; Heatsink Clip; Figure 15. Heatsink Mechanical Gasket, Optional Two-Piece - Intel E7500 Design Manual

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6.3.3

Mechanical Interface Material

Intel recommends the use of a mechanical interface material to avoid cracking of the exposed die
under loading. The interface material reduces mechanical loads experienced by the die. The
reference thermal solution uses a picture frame gasket of 0.813 mm (0.032 in.) thick Poron* foam.
The foam gasket is a two-piece design with diagonal cuts at two corners as shown in Figure 15. A
one-piece gasket design may be used instead without any impact to mechanical performance.

Figure 15. Heatsink Mechanical Gasket, Optional Two-Piece

NOTE: Not to scale.
6.3.4

Thermal Interface Material

A thermal interface material provides improved conductivity between the die and heatsink. The
reference thermal solution uses Chomerics* T-710, 0.127 mm (0.005 in.) thick,
25.4 mm x 25.4 mm (1.0 in. x 1.0 in.) square.
6.3.5

Heatsink Clip

The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to
fasten the clip to the board. See Figure 19 in Appendix B for a mechanical drawing of the clip.
®
Intel E7500 MCH Thermal and Mechanical Design Guidelines
42.34 mm (1.667 in.)
42.34 mm (1.667 in.)
0.81 mm (0.032 in.)
Reference Thermal Solutions
33.20 mm (1.307 in.)
33.20 mm (1.307 in.)
Heatsink_Gasket
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