Figure 5. 0° Angle Attach Methodology (Top View); Figure 6. 0° Angle Attach Heatsink Modifications - Intel E7500 Design Manual

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Figure 5. 0° Angle Attach Methodology (Top View)
Thermocouple Wire
NOTE: Not to scale.
Figure 6. 0° Angle Attach Heatsink Modifications
NOTE: Not to scale.
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Intel E7500 MCH Thermal and Mechanical Design Guidelines
Substrate
1.3 mm (0.05 in.)
(0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter
(1.5 mm (0.06 in.) Depth)
Angle_Attach_Heatsink_Mod
Thermal Metrology
Die
Cement +
Thermocouple Bead
angle_attach_1
19