Power Simulation Software; Figure 7. Thermal Solution Decision Flowchart - Intel E7500 Design Manual

Thermal Metrology
5.2

Power Simulation Software

The power simulation software is a utility designed to dissipate the thermal design power on a
MCH when used in conjunction with an Intel
combination of the Intel
capability of the E7500 chipset enables new levels of system performance. To assess the thermal
performance of an MCH thermal solution under "worst-case realistic application" conditions, Intel
has developed a software utility that operates the chipset at near worst-case power dissipation.
The utility has been developed solely for testing customer thermal solutions at near the thermal
design power. Figure 7 shows a decision flowchart for determining thermal solution needs. Real
future applications may exceed the thermal design power limit for transient time periods. For
power supply current requirements under these transient conditions, refer to each component's
datasheet for the I
representative to obtain a copy of this software.

Figure 7. Thermal Solution Decision Flowchart

Attach device to
board using
normal reflow
process
20
®
Xeon™ processor with 512-KB L2 cache and the higher bandwidth
(Max Power Supply Current) specification. Contact your Intel Field Sales
CC
Start
Attach thermocouples
using recommended
methodology. Setup
the system in the
desired configuation.
Select
heatsink
®
Intel
®
Xeon™ processor with 512-KB L2 cache. The
Run the power
program and
monitor the
device die
temperature.
Heatsink
requied
E7500 MCH Thermal and Mechanical Design Guidelines
Tdie > No
Specification?
Yes
End
Therm_Flowchart
R