Table Of Contents - Intel E7500 Design Manual

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Contents
1 Introduction ..........................................................................................................................7
1.1 Design Flow ............................................................................................................8
1.2 Definition of Terms..................................................................................................9
1.3 Reference Documents ..........................................................................................10
2 Packaging Technology ......................................................................................................11
3 Thermal Simulation............................................................................................................13
4 Thermal Specifications ......................................................................................................15
4.1 Power ....................................................................................................................15
4.2 Die Temperature ...................................................................................................15
5 Thermal Metrology.............................................................................................................17
5.1 Die Temperature Measurements ..........................................................................17
5.1.1
5.1.2
5.2 Power Simulation Software ...................................................................................20
6 Reference Thermal Solutions ............................................................................................21
6.1 Operating Environment .........................................................................................21
6.2 Mechanical Design Envelope................................................................................21
6.3 Thermal Solution Assembly ..................................................................................23
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
6.3.7
6.4 Reliability Requirements .......................................................................................30
Appendix A: Thermal Solution Component Suppliers ............................................................................31
Appendix B: Mechanical Drawings.........................................................................................................33
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Intel E7500 MCH Thermal and Mechanical Design Guidelines
90° Angle Attach Methodology ..............................................................17
0° Angle Attach Methodology ................................................................18
Heatsink Orientations ............................................................................25
Extruded Heatsink Profiles ....................................................................26
Mechanical Interface Material ...............................................................27
Thermal Interface Material ....................................................................27
Heatsink Clip .........................................................................................27
Clip Retention Anchors..........................................................................28
Board Level Component Keep-out Dimensions ....................................28
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