Thermal Solution Assembly; Figure 9. Reference Thermal Solution Assembly - Intel E7500 Design Manual

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Thermal Solution Assembly

The reference thermal solution is a passive extruded heatsink with thermal and mechanical
interfaces. It is attached using a clip with each end hooked through an anchor soldered to the
board. Figure 9 shows the reference thermal solution assembly and associated components.
Figure 9 and Figure 10 show alternate views of the reference solution. Full mechanical drawings of
the thermal solution assembly and the heatsink clip are provided in Appendix B.
Appendix A contains vendor information for each thermal solution component.

Figure 9. Reference Thermal Solution Assembly

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Intel E7500 MCH Thermal and Mechanical Design Guidelines
Heatsin
Thermal
Solder-Down
Reference Thermal Solutions
Anchored
Mechanical
FC-BGA
ref_therm_solution_assy
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