System Thermal Solution Considerations; Chassis Thermal Design Capabilities; Improving Chassis Thermal Performance; Table 2-1. Heatsink Inlet Temperature Of Intel Reference Thermal Solutions - Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU Design Manuallines

2.4

System Thermal Solution Considerations

2.4.1

Chassis Thermal Design Capabilities

The Intel reference thermal solutions and Intel Boxed Processor thermal solutions
assume that the chassis delivers a maximum T
heatsink. The following tables show the T
and Intel Boxed Processor thermal solutions.

Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions

Heatsink Inlet
Temperature
NOTE:
1.

Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions

Heatsink Inlet
Temperature
NOTE:
1.
2.4.2

Improving Chassis Thermal Performance

The heat generated by components within the chassis must be removed to provide an
adequate operating environment for both the processor and other system
components. Moving air through the chassis brings in air from the external ambient
environment and transports the heat generated by the processor and other system
components out of the system. The number, size and relative position of fans and
vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the
thermal solution and the amount of system airflow can be traded off against each
other to meet specific system design constraints. Additional constraints are board
layout, spacing, component placement, acoustic requirements and structural
considerations that limit the thermal solution size. For more information, refer to the
Performance ATX Desktop System Thermal Design Suggestions or Performance
microATX Desktop System Thermal Design Suggestions or Balanced Technology
Extended (BTX) System Design Guide documents available on the
http://www.formfactors.org/
24
ATX D60188-
Intel reference designs (D60188-001 and E18764-001) are assumed be used in the
chassis where expected the temperature rise is 5 °C.
Boxed Processor for Intel
E6000 and E4000 Series, Intel
Processor E2000 Series, and Intel
Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged
chassis (refer to Thermally Advantaged Chassis version 1.1 for Thermally Advantaged
Chassis thermal and mechanical requirements).
web site.
Processor Thermal/Mechanical Information
at the inlet of the processor fan
A
requirements for the reference solutions
A
ATX E18764-001
001
40 °C 40 °C
®
Core Processor E1000 Series
40 °C
Thermal and Mechanical Design Guidelines
BTX Type II
35.5 °C
™
Core 2 Duo Processor
® ®
Pentium Dual Core
® ®
Celeron Dual-